39. Kwang Hwan Kim, Taeho Lim, Seunghoe Choe, Insoo Choi, Sang Hyun Ahn, Myung Jun Kim, Kyung Ju Park, Min Hyung Lee, Jae Jeong             Kim*, and Oh Joong Kwon*, “Direct Cu Electrodeposition on Ta using Pd Nanocolloids - Effects of allyl alcohol on the formation of seed layer”,
      J. Electrochem. Soc., 160(12), D3206-D3210 (2013)

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38. Myung Jun Kim, Kyung Ju Park, Taeho Lim, Oh Joong Kwon*, and Jae Jeong Kim*, “Fabrication of Cu-Ag interconnection using
      electrodeposition: the mechanism of superfilling and the properties of Cu-Ag film”, J. Electrochem. Soc., 160(12), D3126-D3133 (2013)

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37. Kyung Ju Park, Kang Uk Lee, Myeong Ho Kim, Oh Joong Kwon*, and Jae Jeong Kim*, “Preparation of PS/TiO2 as a white pigment for
      electrophoretic display”, Curr. Appl. Phys., 13(7), 1231-1236 (2013)

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36. Myung Jun Kim, Heo Chul Kim, Soo-Hyun Kim, Seungmin Yeo, Oh Joong Kwon*, and Jae Jeong Kim*, “Direct Electrodeposition of Cu
      on Ru-Al2O3 Layer”, J. Electrochem. Soc., 160(12), D3057-D3062 (2013)

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35. Tae Eun Hong, Taehoon Cheon, Soo-Hyun Kim, Jeong-Kyu Kim, Young-Bae Park, Oh Joong Kwon, Myung Jun Kim, and Jae Jeong Kim*,          “Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology”, J. Alloy. Compd., 580, 72-       81 (2013)

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34. Kang Uk Lee, Kyung Ju Park, Oh Joong Kwon*, and Jae Jeong Kim*, “Carbon sphere as a black pigment for an electronic paper”,
      Curr. Appl. Phys., 13(2), 419-424 (2013)