2013
39. Kwang Hwan Kim, Taeho Lim, Seunghoe Choe, Insoo Choi, Sang Hyun Ahn, Myung Jun Kim, Kyung Ju Park, Min Hyung Lee, Jae Jeong Kim*, and Oh Joong Kwon*, “Direct Cu Electrodeposition on Ta using Pd Nanocolloids - Effects of allyl alcohol on the formation of seed layer”,
J. Electrochem. Soc., 160(12), D3206-D3210 (2013)
38. Myung Jun Kim, Kyung Ju Park, Taeho Lim, Oh Joong Kwon*, and Jae Jeong Kim*, “Fabrication of Cu-Ag interconnection using
electrodeposition: the mechanism of superfilling and the properties of Cu-Ag film”, J. Electrochem. Soc., 160(12), D3126-D3133 (2013)
37. Kyung Ju Park, Kang Uk Lee, Myeong Ho Kim, Oh Joong Kwon*, and Jae Jeong Kim*, “Preparation of PS/TiO2 as a white pigment for
electrophoretic display”, Curr. Appl. Phys., 13(7), 1231-1236 (2013)
36. Myung Jun Kim, Heo Chul Kim, Soo-Hyun Kim, Seungmin Yeo, Oh Joong Kwon*, and Jae Jeong Kim*, “Direct Electrodeposition of Cu
on Ru-Al2O3 Layer”, J. Electrochem. Soc., 160(12), D3057-D3062 (2013)
35. Tae Eun Hong, Taehoon Cheon, Soo-Hyun Kim, Jeong-Kyu Kim, Young-Bae Park, Oh Joong Kwon, Myung Jun Kim, and Jae Jeong Kim*, “Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology”, J. Alloy. Compd., 580, 72- 81 (2013)
34. Kang Uk Lee, Kyung Ju Park, Oh Joong Kwon*, and Jae Jeong Kim*, “Carbon sphere as a black pigment for an electronic paper”,
Curr. Appl. Phys., 13(2), 419-424 (2013)
Electrochemical Energy Device Laboratory
Department of Energy and Chemical Engineering
Incheon National University
RESEARCH BLOG
The development of a reactant selective electrocatalyst using the carbon shell having a chemical-physical functionality
We study the Pt catalyst encapsulated by carbon shell. The aim of this study is to figure out the methodology for modulating carbon shell which covers Pt nanoparticle. Some previous study already suggested the mean to make carbon shell coated Pt nanoparticle. However, our approach is more simple and effective than any other approach. As one of the applications, the catalyst is introduced to fuel cell because it is very durable and has reactant selective property.
Development of environmentally friendly plating process of 12-layered any layer multi-flexible PCB for wearable devices
Cu metallization process requires metal seed layer which makes electrodeposition possible on non-conductive substrate. Metal seed layers are usually formed by electroless process (chemical reduction process) and the process uses hazardous chemicals. This study suggests environmentally friendly way to form seed layer and it is introduced to 12-layered any layer multi-flexible PCB processes.
Synthesis of catalyst/PANI based on polyaniline support and its application to fuel cell
There has been various studies for introducing polyaniline to fuel cell as one of component of catalyst or as additive in making catalyst. Every one follows a routine approach of using polyanilne as polymer state. However, polyanline can be used from monomer state to make a composite of Pt and polyaniline. Through the study, we have suggested a new way to use polyaniline in fuel cell field.
Development of reliable fine-pitch metallization technologies
A superfilling of Cu in fine-pitch trench or via is important technology to realize reliable metallization. However, the superfilling becomes more difficult as the pitch size shrinks. Here, we tried several approaches such as Cu deposition without seed layer and Cu-Ag alloy deposition to enhance reliability. Through the study, we could get meaningful results.
