2013
39. Kwang Hwan Kim, Taeho Lim, Seunghoe Choe, Insoo Choi, Sang Hyun Ahn, Myung Jun Kim, Kyung Ju Park, Min Hyung Lee, Jae Jeong Kim*, and Oh Joong Kwon*, “Direct Cu Electrodeposition on Ta using Pd Nanocolloids - Effects of allyl alcohol on the formation of seed layer”,
J. Electrochem. Soc., 160(12), D3206-D3210 (2013)
38. Myung Jun Kim, Kyung Ju Park, Taeho Lim, Oh Joong Kwon*, and Jae Jeong Kim*, “Fabrication of Cu-Ag interconnection using
electrodeposition: the mechanism of superfilling and the properties of Cu-Ag film”, J. Electrochem. Soc., 160(12), D3126-D3133 (2013)
37. Kyung Ju Park, Kang Uk Lee, Myeong Ho Kim, Oh Joong Kwon*, and Jae Jeong Kim*, “Preparation of PS/TiO2 as a white pigment for
electrophoretic display”, Curr. Appl. Phys., 13(7), 1231-1236 (2013)
36. Myung Jun Kim, Heo Chul Kim, Soo-Hyun Kim, Seungmin Yeo, Oh Joong Kwon*, and Jae Jeong Kim*, “Direct Electrodeposition of Cu
on Ru-Al2O3 Layer”, J. Electrochem. Soc., 160(12), D3057-D3062 (2013)
35. Tae Eun Hong, Taehoon Cheon, Soo-Hyun Kim, Jeong-Kyu Kim, Young-Bae Park, Oh Joong Kwon, Myung Jun Kim, and Jae Jeong Kim*, “Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology”, J. Alloy. Compd., 580, 72- 81 (2013)
34. Kang Uk Lee, Kyung Ju Park, Oh Joong Kwon*, and Jae Jeong Kim*, “Carbon sphere as a black pigment for an electronic paper”,
Curr. Appl. Phys., 13(2), 419-424 (2013)
Electrochemical Energy Device Laboratory
Department of Energy and Chemical Engineering
Incheon National University
3. Jun-Yeop Kim, Oh Joong Kwon, Sun-Mi Hwang, Moo Seong Kang, and Jae Jeong Kim*, "Development of a miniaturized polymer electrolyte membrane fuel cell with silicon separator", J. Power Sources., 161, 432-436 (2006)
2. Oh Joong Kwon, Sun-Mi Hwang, Jin-Goo Ahn, and Jae Jeong Kim*, "Silicon-based miniaturized reformer for portable fuel cell application", J. Power Sources., 156(2), 253-259 (2006)
1. Oh Joong Kwon, Seung Hwan Cha, and Jae Jeong Kim*, "Ruthenimum bottom electrode prepared by electroplating for a high-density DRAM capacitor", J. Electrochem.Soc., 151(2), C127-C132 (2004)