2013
39. Kwang Hwan Kim, Taeho Lim, Seunghoe Choe, Insoo Choi, Sang Hyun Ahn, Myung Jun Kim, Kyung Ju Park, Min Hyung Lee, Jae Jeong Kim*, and Oh Joong Kwon*, “Direct Cu Electrodeposition on Ta using Pd Nanocolloids - Effects of allyl alcohol on the formation of seed layer”,
J. Electrochem. Soc., 160(12), D3206-D3210 (2013)
38. Myung Jun Kim, Kyung Ju Park, Taeho Lim, Oh Joong Kwon*, and Jae Jeong Kim*, “Fabrication of Cu-Ag interconnection using
electrodeposition: the mechanism of superfilling and the properties of Cu-Ag film”, J. Electrochem. Soc., 160(12), D3126-D3133 (2013)
37. Kyung Ju Park, Kang Uk Lee, Myeong Ho Kim, Oh Joong Kwon*, and Jae Jeong Kim*, “Preparation of PS/TiO2 as a white pigment for
electrophoretic display”, Curr. Appl. Phys., 13(7), 1231-1236 (2013)
36. Myung Jun Kim, Heo Chul Kim, Soo-Hyun Kim, Seungmin Yeo, Oh Joong Kwon*, and Jae Jeong Kim*, “Direct Electrodeposition of Cu
on Ru-Al2O3 Layer”, J. Electrochem. Soc., 160(12), D3057-D3062 (2013)
35. Tae Eun Hong, Taehoon Cheon, Soo-Hyun Kim, Jeong-Kyu Kim, Young-Bae Park, Oh Joong Kwon, Myung Jun Kim, and Jae Jeong Kim*, “Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology”, J. Alloy. Compd., 580, 72- 81 (2013)
34. Kang Uk Lee, Kyung Ju Park, Oh Joong Kwon*, and Jae Jeong Kim*, “Carbon sphere as a black pigment for an electronic paper”,
Curr. Appl. Phys., 13(2), 419-424 (2013)
Electrochemical Energy Device Laboratory
Department of Energy and Chemical Engineering
Incheon National University
25. Taeho Lim, Hyo-Chol Koo, Kwang Hwan Kim, Kyung Ju Park, Myung Jun Kim, Oh Joong Kwon, and Jae Jeong Kim*, “Room-Temperature Electroless Deposition of CoB Film and its Application as In Situ Capping during Burring Process”, Electrochem. Solid-State Lett., 14(9), D95-D98 (2011)
24. Kyung Ju Park, Hyo-Chol Koo, Taeho Lim, Myung Jun Kim, Oh Joong Kwon, and Jae Jeong Kim*, “Evaluation of Stability and Reactivity of Cu Electroless Deposition Solution by In-situ Transmittance Measurement”, J. Electrochem. Soc., 158(9), D541-D545 (2011)
23. Young Jun Kim Min Cheol Kang, Oh Joong Kwon and Jae Jeong Kim*, “Gallic Acid as a Complexing Agent for Copper Chemical Mechanical Polishing Slurries at Neutral pH”, Jpn. J. Appl. Phys., 50, 056501-1 ~ 056501-4 (2011)
22. Sung Ki Cho, Myung Jun Kim, Taeho Lim, Oh Joong Kwon, and Jae Jeong Kim*, “Deposit profiles characterized by the seed layer in Cu pulse-reverse plating on a patterned substrate”, J. Vac. Sci. Technol., B,. 29(1), 011004-011009 (2011)
21. Oh Joong Kwon, Jae Han Bae, Yung Jun Kim and Jae Jeong Kim*, “Investigation of cleaning solution composed of citric acid and 5- aminotetrazole”, Korean J. Chem. Eng., 28(7), 1619-1624 (2011)
20. Insoo Choi, Sang Hyun Ahn, Jae Jeong Kim, and Oh Joong Kwon*, “Preparation of Pt shell - Pd core nanoparticle with electroless deposition of copper for polymer electrolyte membrane fuel cell”, Appl. Catal., B, 102(3), 608-613 (2011)
19. Oh Joong Kwon, Moo Seong Kang, Sang Hyun Ahn, Insoo Choi, Kang Uk Lee, Jee Hoon Jeong, In-Su Han, Jae Chun Yang, and Jae Jeong Kim*, “Development of flow field design of polymer electrolyte membrane fuel cel using in-situ impedance spectroscopy”, Int. J. Hydrogen Energ., 36(1), 9799-9804 (2011)